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AGC developed "quartz lens" for deep uv LED

作者:SystemMaster  date:2018-06-01 16:40:36

Tokyo, Jan. 16, 2018 -- AGC asahi glass (AGC) has developed a quartz lens for deep uv leds (figure 1). With this product, the manufacturing process of deep uv LED can be greatly simplified and the capital investment is also reduced. The prototype design will begin in the third quarter of 2018 and mass production is scheduled to begin in 2019.

Figure 1: newly developed products


At present, water and air disinfection is mainly carried out by mercury lamp. However, as mercury is harmful to the human body and the environment, the production of mercury lamps may be greatly restricted in the future in accordance with the minamata convention on mercury. Deep ultraviolet LED has little influence on the environment, but has strong disinfection effect, which is expected to be a new generation of light source instead of mercury lamp. The market is expected to reach y30bn (*1) by 2020.

However, there are some problems with existing deep uv leds (figure 2). One is about transparent adhesives that connect lenses and window materials, which are not only expensive but also prone to ultraviolet degradation. The other is about the solder currently used to connect encapsulation and Windows. The client must have a large oxygen equipment when sealing, due to the existing solder hardness, encapsulation and window CTE differences caused by thermal stress can attack directly encapsulation and Windows interface, so the uv LED products are at risk of cracking and leakage.

Figure 2: existing products


To solve these problems, AGC asahi has developed a new quartz lens for deep ultraviolet LED (figure 2). The product USES AGC's proprietary technology to integrate quartz window materials and lenses so that transparent adhesive is no longer needed. In addition, the "special solder" developed by AGC has been coated so that customers can connect the lens to the cavity by simply adding heat and pressure in the atmosphere without using large deoxygenation equipment. In addition, the "special solder" is soft, relieving the thermal stress caused by the difference between packaging and window CTE, neither cracking nor air leakage. Through these methods, the manufacturing process of deep uv LED can be greatly simplified and the capital investment is also reduced.



AGC will carry this product to attend on January 17, 2018 (Wednesday) to January 19 (Friday) with Ming international exhibition center in Tokyo the 47th NEPCON JAPAN semiconductor and sensor encapsulation technology, booth number is 3 east hall E27-47.

Under the guidance of "AGC plus" business policy, AGC asahi group is committed to creating products with "new value and new functions" to bring customers a more "secure, safe and comfortable" life. AGC asahi will make full use of its electronic component technology developed over the years to provide the world with high value-added products.

(*1) source: LED related market survey in 2017 by Fuji kemere general research institute

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